Light can “heal” defects in some solar cells
Defects in some new electronic materials can be removed by making ions move under illumination.
Speedy terahertz-based system could detect explosives
Spectroscopic system with chip-scale lasers cuts detection time from minutes to microseconds.
New approach to sorting cells
Microfluidic device distinguishes cells based on how they respond to acoustic vibrations.
Good medicine
Varesh Prasad, an MIT graduate student in health sciences and technology, is creating a multidisciplinary future in health care.
Stabilizing quantum bits
Feedback technique used on diamond “qubits” could make quantum computing more practical.
New institute will accelerate innovations in fibers and fabrics
National public-private consortium led by MIT will involve manufacturers, universities, agencies, companies.
Monterrey Tec researchers exhilarated by nanotech challenges
The Tec de Monterrey and MIT Program fosters exchanges in nanotechnology and nanoscience, with the goal of helping the Tec to become a research university.
In global efforts to address climate change, electrical engineers have crucial role
In student energy seminar, Professor Rajeev Ram illustrates engineering solutions to energy issues.
EECS announces four faculty promotions
Palacios, Shah, Tedrake promoted to full professor; Englund promoted to associate professor without tenure.
John Wyatt, longtime MIT professor and cofounder of Boston Retinal Implant Project, dies at 69
Dedicated researcher was a circuits expert developing a retinal implant to help the blind see.
Energy-friendly chip can perform powerful artificial-intelligence tasks
Advance could enable mobile devices to implement “neural networks” modeled on the human brain.
New chip fabrication approach
Depositing different materials within a single chip layer could lead to more efficient computers.
A new quantum approach to big data
System for handling massive digital datasets could make impossibly complex problems solvable.
Self-stacking nanogrids
Polymer nanowires that assemble in perpendicular layers could offer route to tinier chip components.