The hidden structure behind a widely used class of materials
Relaxor ferroelectrics have been used in electronics and sensors for decades, but the source of their unique properties was a mystery until now.
Relaxor ferroelectrics have been used in electronics and sensors for decades, but the source of their unique properties was a mystery until now.
MIT researchers’ new fabrication technique can produce soft, microscopic structures with magnetically activated moving parts.
Startup accelerator program grows to over 30 companies, almost half of them with MIT pedigrees.
MIT physicists have discovered 3D “moiré crystals” that simulate four-dimensional quantum materials to a T.
The electrical engineering and nanotechnology leader will guide the US Army-sponsored research center as it advances next-generation materials, electronics, and photonics for national security.
Build for Ukraine 2.0 united students, researchers, and Ukrainian collaborators to prototype solutions shaped by wartime conditions.
New insights into metallic cracks that harm battery performance could advance the longstanding quest to develop energy-dense solid-state batteries.
This award-winning startup with roots at the MIT Energy Initiative is developing lightweight, flexible, high-efficiency solar energy films designed to be used on roofs, walls, and any curved surface.
The technology could enable fast, point-of-care diagnoses for pneumonia and other lung conditions.
The advanced manufacturing group becomes a member and will contribute equipment to MIT.nano.
MIT researchers uncovered the physics behind bubble-removing membranes that could improve bioreactors, chemical production, and more.
The X-ray diffraction and imaging facility at MIT.nano adds a new tool to support research in a wide variety of disciplines.
The flexible material could enable on-demand heat dissipation for electronics, fabrics, and buildings.
New framework supports design and fabrication of compliant materials such as printable textiles and functional foams, letting users predict deformation and material failure.