Commercializing integrated photonics
AIM Photonics fall meeting attendees tackle plans for making computer chips with integrated optical devices and developing a regional workforce.
Designing for 3-D printing
“Foundry” tool from the Computer Science and Artificial Intelligence Lab lets you design a wide range of multi-material 3-D-printed objects.
Advancing manufacturing innovation on campus and online
The White House highlights MIT’s latest efforts as part of National Manufacturing Day.
Manufacturing microspheres
Technique mass-produces uniform, encapsulated particles for pharmaceuticals, many other uses.
Solve at HUBweek offers local showcase, global springboard for solutions to society’s challenges
Innovators from many sectors to tackle issues involving the digital economy, education, and more.
New movie screen allows for glasses-free 3-D at a larger scale
Prototype display enables viewers to watch a 3-D movie from any seat in a theater.
MIT announces Solve program activities
Addressing the world’s most pressing issues, second year of program will focus on in-person gatherings, solution proposals.
Duane Boning named LeBel Professor
A leader in the field of manufacturing and design has been appointed the Clarence J. LeBel Professor of Electrical Engineering.
MIT to launch Hong Kong Innovation Node in June
Launch celebration and inaugural program for students marks the beginning of MIT’s long-term presence in Hong Kong.
New method snips complex fibers into uniform particles
Stretching process can produce nanoscale rods or strips made of many material combinations.
3-D Printing 101
As MIT course challenges students to reinvent 3-D printing, professor aims to share approach with others.
Fast-tracking medical device development
Brian Anthony teams researchers and physicians with industry to accelerate advances in patient care.
New institute will accelerate innovations in fibers and fabrics
National public-private consortium led by MIT will involve manufacturers, universities, agencies, companies.
Q&A: John Hansman on the first global standards for aircraft emissions
Aviation is “a critical link in solving worldwide environmental challenges,” says MIT professor.
Self-stacking nanogrids
Polymer nanowires that assemble in perpendicular layers could offer route to tinier chip components.