Lincoln Laboratory reports on airborne threat mitigation for the NYC subway
Researchers studied air flow characteristics, sensor performance, and mitigation strategies within this complex subway system.
Researchers studied air flow characteristics, sensor performance, and mitigation strategies within this complex subway system.
The MIT community celebrates their fellow staff members’ talent and dedication to the Institute.
Lincoln Laboratory's 3D microwave imaging technology for detecting concealed threats was integrated into HEXWAVE, commercially developed by Liberty Defense.
The Language/AI Incubator, an MIT Human Insight Collaborative project, is investigating how AI can improve communications among patients and practitioners.
The MIT Energy Initiative’s annual research symposium explores artificial intelligence as both a problem and a solution for the clean energy transition.
PhD candidate Sabrina Corsetti builds photonic devices that manipulate light to enable previously unimaginable applications, like pocket-sized 3D printers.
Lincoln Laboratory cybersecurity expert Hamed Okhravi calls for a unified approach to securing computer memory, as a matter of national security.
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Longtime MIT electrical engineer receives SPIE Frits Zernike Award for Microlithography in recognition of outstanding accomplishments in microlithographic technology.
By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
MIT Lincoln Laboratory developed the system, launched recently aboard the QZSS-HP satellite, for a collaborative effort between the US Space Force and Japan.
The system will support US Army missions.
Researchers achieved a type of coupling between artificial atoms and photons that could enable readout and processing of quantum information in a few nanoseconds.
Preventing 3D integrated circuits from overheating is key to enabling their widespread use.
Lincoln Laboratory is transitioning tools to the 618th Air Operations Center to streamline global transport logistics.