MLK Celebration includes installation, youth forum
Julian Bond will be the keynote speaker at the annual celebratory breakfast on Friday, the centerpiece of MIT's 29th celebration of the life and legacy of Dr. Martin Luther King Jr.
Bond, a professor at the University of Virginia and chair of the National Association for the Advancement of Colored People, will address this year's theme, "Faces at the Bottom of the Well: Nightmare of Reality vs. Dr. King's Dream." The breakfast will take place in La Sala de Puerto Rico in the Stratton Student Center. For information see http://web.mit.edu/mlking/www.
Two other special events are planned:
The 38 students in the IAP for Martin Luther King Jr. Design Seminar developed three projects on the theme "Social Justice is a Journey." In addition to the weekend installation that debuted in Lobby 10 last Friday, they published a special four-page supplement in the Feb. 11 edition of The Tech. The installation will be on display through the weekend.
- About 200 youths from Boston, Cambridge and Springfield will participate Saturday in "Shake Up the World!"--a conference co-sponsored by the Center for Reflective Community Practice and the planning committee for the MLK celebration. The youth forum includes interactive workshops, speakers and performances.
Faculty meeting agenda
A regular meeting of the faculty will be held Wednesday, Feb. 19 at 3:30 p.m. in Room 10-250. The agenda:
- Update on the CUP-approved bachelor of science degree in archeology and materials (Course III-C) by Professor Kip Hodges
- Report on the CUP-approved Comparative Media Studies undergraduate degree program, by Hodges
- Proposed process for the approval of new undergraduate degree programs, by Hodges and Stephen Meyer
- Update on the Student and Exchange Visitor Information Systems (SEVIS), by Danielle Guichard-Ashbrook, director of the International Students Office, and Penny Rosser, director of the International Scholars Office.
A version of this article appeared in MIT Tech Talk on February 12, 2003.
