The high-tech wizardry of integrated photonics
PhD candidate Sabrina Corsetti builds photonic devices that manipulate light to enable previously unimaginable applications, like pocket-sized 3D printers.
PhD candidate Sabrina Corsetti builds photonic devices that manipulate light to enable previously unimaginable applications, like pocket-sized 3D printers.
By leveraging reflections from wireless signals like Wi-Fi, the system could allow robots to find and manipulate items that are blocked from view.
Co-founded by Professor Desirée Plata, the company is already producing nickel and cobalt from battery scrap in Ohio.
The low-cost, scalable technology can seamlessly integrate high-speed gallium nitride transistors onto a standard silicon chip.
Researchers designed a tiny receiver chip that is more resilient to interference, which could enable smaller 5G “internet of things” devices with longer battery lives.
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Longtime MIT electrical engineer receives SPIE Frits Zernike Award for Microlithography in recognition of outstanding accomplishments in microlithographic technology.
By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
The magnetic state offers a new route to “spintronic” memory devices that would be faster and more efficient than their electronic counterparts.
MIT senior Maria Aguiar loves everything about materials science — but has a soft spot for garnet thin films, the focus of her undergraduate research.
Nona Technologies exemplifies how J-WAFS has helped launch real-world solutions for global water and food challenges.
Researchers achieved a type of coupling between artificial atoms and photons that could enable readout and processing of quantum information in a few nanoseconds.
Preventing 3D integrated circuits from overheating is key to enabling their widespread use.
Speakers described challenges and potential solutions for producing materials to meet demands associated with data centers, infrastructure, and other technology.
MIT engineers developed an insect-sized jumping robot that can traverse challenging terrains and carry heavy payloads.